Eliyan is building NuLink, a proprietary die-to-die chiplet interconnect fabric purpose-built for AI infrastructure at hyperscale. As Eliyan expands into co-packaged optics (CPO), the Director (or higher-level depending on experience) of Optical Product Development owns the product strategy for integrating third-party optical components — VCSELs, photodetectors, lenses, and fiber interfaces — with Eliyan's silicon die at the package level. This role requires deep familiarity with semiconductor fabrication and assembly processes, as all optical integration decisions are constrained by and executed within a semiconductor packaging environment.