Job Summary:
Seeking a Process Engineer with 3-5 years of semiconductor industry experience in Wafer Saw (Dicing), Blade Dicing, Backgrind, or DBG processes.
Job Responsibility
- Define/optimize procedures to ensure smooth processing of production lots
- Develop and maintain process documentation and SOPs including operator training
- Lead root cause analysis for defects and yield losses
- Provide disposition on lots with quality issues
- Support new product introduction and process qualification
- Analyze production data to identify process improvements
- Collaborate with cross-functional teams on cost reduction and process improvement projects
- Perform change management including new material qualification
Qualification
- Bachelor's or master's degree in Engineering (Electronics, industrial, Chemical, Mechanical, or related field).
- 3–5 years of process engineering experience with standard backgrind and dicing before grinding (DBG) process.
- Strong data analysis and problem-solving skills.
- Experience with Statistical Process Control (SPC) and process validation (preferred).
- With good command of English language.
- Knowledge of Lean, Six Sigma, or continuous improvement tools (advantage).
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